Test structure of DRAM

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S304000, C257S302000, C257S301000

Reexamination Certificate

active

06891216

ABSTRACT:
A test structure of a DRAM array includes a substrate. A transistor is formed on the substrate and has a first region and a second region as source/drain regions thereof. A deep trench capacitor is formed adjacent to the transistor and has a first width. A shallow trench isolation is formed in a top portion of the deep trench capacitor and has a second width. The second width is substantially shorter than the first one. A third region is formed adjacent to the deep trench capacitor. A first contact is formed on the substrate and contacts with the first region. A second contact is formed on the substrate and contacts with the third region.

REFERENCES:
patent: 4905065 (1990-02-01), Selcuk et al.
patent: 4921815 (1990-05-01), Miyazawa
patent: 5225698 (1993-07-01), Kim et al.
patent: 5250829 (1993-10-01), Bronner et al.
patent: 5264716 (1993-11-01), Kenney
patent: 5798545 (1998-08-01), Iwasa et al.
patent: 20030178661 (2003-09-01), Tzeng et al.

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