Test circuit for logical integrated circuit and method for...

Error detection/correction and fault detection/recovery – Pulse or data error handling – Digital logic testing

Reexamination Certificate

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Reexamination Certificate

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07069486

ABSTRACT:
A scan path is formed by successively connecting the flip-flop FF11x located at the head of the xth stage to the flip-flop FF1mx located at the end of the xth stage in series. The scan path connects the scan input SIN with the input terminal of the flip-flop FF11n located at the head of the nth stage, and successively connects the flip-flop arranged in the second to (n−1)th stages in series, after restarting from the output terminal of the flip-flop FF1nm located at the end of the nth stage. The output terminal of the flip-flop FF1m(n−1) located at the end of the (n−1)th stage is connected with the input terminal of the flip-flop FF111located at the head of the first stage, and, finally, the output terminal of the flip-flop FF1m1located at the end of the first stage is connected with the scan output SOT.

REFERENCES:
patent: 5544173 (1996-08-01), Meltzer
patent: 6199182 (2001-03-01), Whetsel
patent: 6343365 (2002-01-01), Matsuzawa et al.
patent: 6574760 (2003-06-01), Mydill
patent: 404050783 (1992-04-01), None
patent: 02000097997 (2000-04-01), None
patent: P3092704 (2000-07-01), None
patent: 413981 (2000-12-01), None
“IDDQ and AC Scan: The War Against Unmodelled Defects” by Maxwell et al. International Test Conference Proceedings Publication Date: Oct. 20-25, 1996, pp. 250-258 Inspec Accession Number: 5539851.
“The Testability Features of the 3rd Generation ColdFire(R) Family of Microprocessors” by Crouch et al. International Test Conference Proceedings Publication Date: Sep. 28-30, 1999, pp. 913-922 Inspec Accession Number: 6536446.
“Analogue Boundary Scan Architecture for DC and AC Testing” by Kuen-Jong Lee et al. Electronics Letters Publication Date: Apr. 1, 1996, pp. 704-705 vol. 32 , Issue: 8 Inspec Accession Number: 5251377.

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