Temperature control in a chemical mechanical polishing system

Details Temperature control in a chemical mechanical polishing system Temperature control in a chemical mechanical polishing system

2006-12-26

2006-12-26

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

C451S053000, C451S286000, C451S398000

Reexamination Certificate

active

07153188

ABSTRACT:
The carrier head has a base and a substrate backing structure for holding a substrate against a polishing surface during polishing. The substrate backing structure is connected to the base and includes an external surface that contacts a backside of the substrate during polishing. The substrate backing structure also includes a resistive heating system to distribute heat over an area of the external surface and at least one thermally conductive membrane. The external surface is a first surface of the at least one thermally conductive membrane, and the resistive heating system is integrated within one of the at least one thermally conductive membrane.

REFERENCES:
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5980363 (1999-11-01), Meikle et al.
patent: 6488571 (2002-12-01), Sharan
patent: 6638141 (2003-10-01), Ide
patent: 6726529 (2004-04-01), Marcyk et al.
patent: 6736720 (2004-05-01), Bright et al.
patent: 6749484 (2004-06-01), Yang et al.
Peggy Cobb,Silicone-rubber heaters stretch product utility, Machine Design, Sep. 24, 1998, at 166.

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