Techniques for patterning features in semiconductor devices

Details Techniques for patterning features in semiconductor devices Techniques for patterning features in semiconductor devices

2006-04-18

2006-04-18

Nguyen, Cuong (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S700000, C438S701000

Reexamination Certificate

active

07030008

ABSTRACT:
Techniques for semiconductor processing are provided. In one aspect, a method for patterning one or more features in a semiconductor device comprises the following step. At least one critical dimension of the one or more features is reduced during etching of the antireflective material. A lithographic structure is also provided.

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