Technique for improving chucking reproducibility

Details Technique for improving chucking reproducibility Technique for improving chucking reproducibility

2005-02-22

2005-02-22

Barr, Michael (Department: 1762)

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

C427S574000, C427S573000, C427S579000, C427S314000, C427S255280, C427S237000

Reexamination Certificate

active

06858265

ABSTRACT:
Method and apparatus for improving the reproducibility of chucking forces of an electrostatic chuck used in plasma enhanced CVD processing of substrates provides for precoating of the electrostatic chuck with a dielectric layer, such as SiO2, after every chamber cleaning process. The uniform and tightly bonded dielectric layer deposited on the electrostatic chuck eliminates the need for a cover wafer over the chuck surface during the chamber cleaning and provides for more reliable gripping of wafers.

REFERENCES:
patent: 4923715 (1990-05-01), Matsuda et al.
patent: 5221414 (1993-06-01), Langley et al.
patent: 5279865 (1994-01-01), Chebi et al.
patent: 5300460 (1994-04-01), Collins et al.
patent: 5315473 (1994-05-01), Collins et al.
patent: 5429070 (1995-07-01), Campbell et al.
patent: 5454903 (1995-10-01), Redeker et al.
patent: 5539179 (1996-07-01), Nozawa et al.
patent: 5668524 (1997-09-01), Aida et al.
patent: 5679215 (1997-10-01), Barnes et al.
patent: 5712702 (1998-01-01), McGahay et al.
patent: 5748436 (1998-05-01), Honma et al.
patent: 5811356 (1998-09-01), Murugesh et al.
patent: 6524955 (2003-02-01), Fukuda et al.

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