Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1997-04-24
2000-04-11
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257781, 257782, 257786, H01L 23495
Patent
active
060491213
ABSTRACT:
A tape carrier package includes a semiconductor chip including a first row of electrode bumps formed on a surface of a semiconductor chip and a second row of electrode bumps formed on the surface of the semiconductor chip parallel to the first row. The tape carrier package also includes an insulating film, at least a portion of the insulating film being formed on the semiconductor chip, a conductor pattern including a first lead section formed on the insulating film and connectable to an external device and a second lead section extending from the first lead section so as to electrically connect to the first and second rows of electrode bumps. At least a part of the first lead section is positioned on the semiconductor chip. A sealing resin is provided for sealing at least a junction between the first and second rows of electrode bumps and the second lead section.
REFERENCES:
patent: 5355019 (1994-10-01), Fuchs
patent: 5550408 (1996-08-01), Kunitomo et al.
patent: 5598030 (1997-01-01), Imai et al.
patent: 5616958 (1997-04-01), Laine et al.
patent: 5726491 (1998-03-01), Tajima et al.
Asazu Takuro
Tajima Naoyuki
Toyosawa Kenji
Clark Sheila V.
Sharp Kabushiki Kaisha
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