Systems and methods for scan test access using bond pad test...

Details Systems and methods for scan test access using bond pad test... Systems and methods for scan test access using bond pad test...

2006-10-31

2006-10-31

Ton, David (Department: 2138)

Error detection/correction and fault detection/recovery

Pulse or data error handling

Digital logic testing

C714S729000

Reexamination Certificate

active

07131045

ABSTRACT:
The present invention is directed to circuits and methods to efficiently conduct scan testing of integrated circuits in which first level packaging is varied to provide different versions of the integrated circuit. An integrated circuit is provided that includes at least one bond pad test circuit. The bond pad test circuit is coupled between a bond pad and functional components within an integrated circuit. In one embodiment, the bond pad test circuit includes a multiplexer and a D flip-flop in which the D input of the flip-flop is coupled to a bond pad. In another embodiment, the bond pad test circuit includes a multiplexer and a D flip-flop in which the D input of the flip-flop is coupled to the output of the multiplexer. A method for scan testing using an integrated circuit with a bond pad test circuit is also provided.

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