System and method for providing access to an encapsulated...

Details System and method for providing access to an encapsulated... System and method for providing access to an encapsulated...

2006-05-17

2009-06-23

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S433000, C257SE33058, C257SE31117, C257SE23122, C257SE23128

Reexamination Certificate

active

07550778

ABSTRACT:
A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer with the device wafer so that the cavity is located substantially above the feature, and removing material substantially uniformly from the bottom surface of the lid wafer, until an aperture is formed at the cavity, over the feature on the device wafer. By removing material from the lid wafer in a substantially uniform manner, difficulties with the prior art procedure of saw cutting, such as alignment and debris generation, are avoided.

REFERENCES:
patent: 6686225 (2004-02-01), Wachtler
patent: 6777263 (2004-08-01), Gan et al.
patent: 2002/0088988 (2002-07-01), Silverbrook
patent: 2002/0089025 (2002-07-01), Chou
patent: 2003/0118277 (2003-06-01), Yu et al.
patent: 2006/0138579 (2006-06-01), Shin et al.
Van Zant, P. Microchip fabrication: a practical guide to semiconductor processing, 4thed. New York, McGraw-Hill, 1000, ISBN 0071356363. pp. 62-63, 82-84, and 567.

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