4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Gregory A. Carlson

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MEMS device using NiMn alloy and method of manufacture

Electricity: electrothermally or thermally actuated switches – Electrothermally actuated switches – With longitudinally expansible solid element
Reexamination Certificate

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MEMS thermal actuator and method of manufacture

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate

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System and method for providing access to an encapsulated...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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Wafer level hermetic bond using metal alloy with raised feature

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Wafer level hermetic bond using metal alloy with raised feature

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2219978

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