4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Subsequent separation into plural bodies

David A Zarneke

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Adhesion by plasma conditioning of semiconductor chip

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Adhesion improvement for low k dielectrics

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
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Adhesive for electronic components, method for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
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Aluminum cap for reducing scratch and wire-bond bridging of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Apparatus and method configured to lower thermal stresses

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
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Profile ID: LFUS-PAI-P-359785

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