4. Electric heating
  5. Metal heating
  6. For bonding with pressure

David M. Erlach

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Soldering tip for magnetic wire hookup

Electric heating – Metal heating – For bonding with pressure
Patent

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System and method for providing access to an encapsulated...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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Wafer level hermetic bond using metal alloy with raised feature

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Wafer level hermetic bond using metal alloy with raised feature

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1342985

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