Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Multiple layers
Reexamination Certificate
2007-07-03
2007-07-03
Smith, Zandra V. (Department: 2822)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Multiple layers
C438S761000, C438S952000, C438S948000, C438S949000, C438S950000
Reexamination Certificate
active
11069177
ABSTRACT:
The present disclosure relates generally to the manufacturing of semiconductor devices, and more particularly to semiconductor manufacturing using a vacuum chamber. In one example, a method for semiconductor manufacturing includes: providing a photoresist layer for a wafer; removing solvent residues from the photoresist layer by using a vacuum chamber; and exposing the wafer.
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Haynes and Boone LLP
Novacek Christy
Taiwan Semiconductor Manufacturing Company , Ltd.
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