System and method for in-line metal profile measurement

Details System and method for in-line metal profile measurement System and method for in-line metal profile measurement

2006-09-05

2006-09-05

Hail, III, Joseph J. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S041000, C451S057000, C451S056000, C451S286000, C451S287000, C451S288000, C451S443000, C451S444000

Reexamination Certificate

active

07101254

ABSTRACT:
A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.

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