Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2007-08-28
2007-08-28
Pham, Hoai (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S778000, C257S797000
Reexamination Certificate
active
10736618
ABSTRACT:
A surface mount chip package comprises a package housing made of a prescribed resin, which is formed to cover a semiconductor chip while avoiding a plurality of conductors extending from the semiconductor chip. A plurality of solder balls are arranged in the package housing in correspondence with a main surface of the semiconductor chip having an integrated circuit and are interconnected with the conductors respectively. An index serving as a marking member is arranged together with the solder balls so as to bring a directivity realized by the shape thereof when viewed in the thickness direction of the semiconductor chip. This allows a user to easily recognize the inclination and position of the package housing without using the solder balls in view of the index, thus establishing a prescribed positioning for an electrical test such as a probing test.
REFERENCES:
patent: 6495916 (2002-12-01), Ohuchi et al.
patent: 6787892 (2004-09-01), Furuya et al.
patent: 3-142848 (1991-06-01), None
patent: 04-323836 (1992-11-01), None
patent: 2001-144197 (2001-05-01), None
patent: 2002-176265 (2002-06-01), None
patent: 399779 (2000-07-01), None
Taiwanese Office Action dated Jun. 7, 2005 (w/English translation of relevant portions).
Dickstein , Shapiro, LLP.
Nguyen Dilinh
Pham Hoai
Yamaha Corporation
LandOfFree
Surface mount chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Surface mount chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface mount chip package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3827518