Structure of a semiconductor package including chips bonded to d

Details Structure of a semiconductor package including chips bonded to d Structure of a semiconductor package including chips bonded to d

1997-08-19

1999-10-12

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257789, 257779, 257723, 257794, 257795, 257738, 257701, H01L 2354, H01L 2334, H01L 2328

Patent

active

059659475

ABSTRACT:
In a semiconductor package which includes a plurality of semiconductor chips of different kinds, some of the chips are bonded to die bonding pad by means of a conductive adhesive, while the other chips are bonded by means of a non-conductive adhesive that contains highly insulating beads. Encapsulation of the package is by a molding compound. A nitride film or an organic insulating film is disposed on a back side of the chips bonded by the non-conductive adhesive to improve the withstand voltage between these chips and the die pad.

REFERENCES:
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patent: 5349240 (1994-09-01), Narita et al.
patent: 5389817 (1995-02-01), Imamura et al.
patent: 5455452 (1995-10-01), Kiyono
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5629566 (1997-05-01), Doi et al.
patent: 5756207 (1998-05-01), Clough et al.

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