4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Seung-Kon Mok

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Ball grid array attaching means having improved reliability...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Circuit board including solder ball land having hole and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Circuit board including solder ball land having hole and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Hollow solder structure having improved reliability and...

Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles
Reexamination Certificate

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Semiconductor package having support film formed on inner leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Profile ID: LFUS-PAI-P-581828

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