Structure and method of fabricating high-density...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S324000, C257S328000, C257S329000, C257SE21410, C438S216000, C438S269000, C438S261000, C438S270000, C438S271000, C438S591000, C438S593000

Reexamination Certificate

active

07816728

ABSTRACT:
The present invention provides two-transistor silicon-oxide-nitride-oxide-semiconductor (2-Tr SONOS) non-volatile memory cells with randomly accessible storage locations as well as method of fabricating the same. In one embodiment, a 2-Tr SONOS cell is provided in which the select transistor is located within a trench structure having trench depth from 1 to 2 μm and the memory transistor is located on a surface of a semiconductor substrate adjoining the trench structure. In another embodiment, a 2-Tr SONOS memory cell is provided in which both the select transistor and the memory transistor are located within a trench structure having the depth mentioned above.

REFERENCES:
patent: 5051917 (1991-09-01), Gould et al.
patent: 5313419 (1994-05-01), Chang
patent: 5424569 (1995-06-01), Prall
patent: 5598367 (1997-01-01), Noble
patent: 5616510 (1997-04-01), Wong
patent: 6239465 (2001-05-01), Nakagawa
patent: 6444525 (2002-09-01), Lee
patent: 6680230 (2004-01-01), Arai et al.
patent: 6787419 (2004-09-01), Chen et al.
patent: 6842370 (2005-01-01), Forbes
patent: 6894339 (2005-05-01), Fan et al.
patent: 7037787 (2006-05-01), Fan et al.
patent: 7118967 (2006-10-01), Ngo et al.
patent: 2002/0153546 (2002-10-01), Verhaar
patent: 2002/0182786 (2002-12-01), Chien et al.
patent: 2004/0183124 (2004-09-01), Hsu
patent: 1540762 (2004-10-01), None
patent: 1271652 (2003-01-01), None
Swift, et al., “An embedded 90nm SONOS nonvolatile memory utilizing hot electron programming and uniform tunnel erase,”IEDM Tech. Dig., pp. 927-930, Dec. 2002.
PCT International Search Report dated Jan. 28, 2007.
International Search Report and the Written Opinion of the International Searching Authority for PCT/US2006/013561, Date of Mailing Jan. 29, 2007.

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