Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2005-11-15
2005-11-15
Zarabian, Amir (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S121000, C438S106000, C257S712000, C257S720000
Reexamination Certificate
active
06964885
ABSTRACT:
An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.
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Coico Patrick Anthony
Covell James H.
Fasano Benjamin V.
Goldman Lewis S.
Hering Ronald L.
Blecker Ira D.
International Business Machines - Corporation
Tran Thanh Y.
Zarabian Amir
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