4. Metal fusion bonding
  5. Process
  6. Plural filler applying

James H. Covell

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Low temperature solder column attach by injection molded...

Metal fusion bonding – Process – Plural filler applying
Reexamination Certificate

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Method and apparatus for removing known good die

Metal fusion bonding – Process of disassembling bonded surfaces – per se
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One step method for curing and joining BGA solder balls

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Optical sensing method to place flip chips

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
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Stress resistant land grid array (LGA) module and method of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
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Profile ID: LFUS-PAI-P-2035521

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