4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Patrick Anthony Coico

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Semiconductor package with low strain seal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Semiconductor package with low strain seal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Stress resistant land grid array (LGA) module and method of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Stress resistant land grid array (LGA) module and method of...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1864924

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