Stress-relief layers and stress-compensation collars with...

Details Stress-relief layers and stress-compensation collars with... Stress-relief layers and stress-compensation collars with...

2007-11-06

2007-11-06

Smith, Bradley K. (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000

Reexamination Certificate

active

11736280

ABSTRACT:
A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

REFERENCES:
patent: 2002/0185309 (2002-12-01), Imamura et al.
patent: 2003/0214036 (2003-11-01), Sarihan et al.
patent: 2004/0149479 (2004-08-01), Chiu et al.
patent: 2005/0218517 (2005-10-01), Capote et al.
patent: 2006/0068579 (2006-03-01), Suh et al.

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