Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate
2006-10-17
2006-10-17
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
Small lead frame for connecting a large lead frame to a...
Reexamination Certificate
active
07122883
ABSTRACT:
A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.
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U.S. Appl. No. 09/453,171, filed Dec. 2, 1999.
Kawamura Masayasu
Masuda Masachika
Nishizawa Hirotaka
Sugano Toshio
Sugiyama Michiaki
Antonelli, Terry Stout and Kraus, LLP.
Harrison Monica D.
Hitachi , Ltd.
Hitachi Ulsi Systems Co., Ltd.
Jr. Carl Whitehead
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