Stacked chip assembly utilizing a lead frame

Details Stacked chip assembly utilizing a lead frame Stacked chip assembly utilizing a lead frame

1999-04-26

2000-09-12

Guay, John

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257686, 257692, 257693, 257777, 257779, 257784, 257786, 361790, 361813, H01L 23495

Patent

active

061181765

ABSTRACT:
A stacked chip assembly generally includes a first chip, a second chip and a lead frame. The lower surface of the first chip is pasted onto the lower surface of the second chip by an adhesive film so as to form a stacked chip body. The stacked chip body is disposed on the lead frame. Bonding pads of the upper surface of the first chip are interconnected to the upper surface of the inner leads of the lead frame by bonding wires. Bonding pads of the upper surface of the second chip are interconnected to the lower surface of the inner leads of the lead frame by bonding wires. Therefore, the first chip and the second chip are simultaneously interconnected to an external circuit devices through the lead frame.

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