4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Kuang-Chun Chou

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active

Leadframe with die pad and leads corresponding thereto

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Stacked chip assembly utilizing a lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Substrate strip with sides having flanges and recesses

Stock material or miscellaneous articles – Perimeter or corner structure of sheet
Reexamination Certificate

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Profile ID: LFUS-PAI-P-212216

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