Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
Inventor
active
Axial sealing mechanism of volute compressor
Back-pressure sealing system for revolving compressor
Ball bonding method on a chip
Ball grid array semiconductor package having improved heat...
Ball grid array semiconductor package with improved strength...
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Profile ID: LFUS-PAI-P-212214