4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Kuang-Lin Lo

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Fabrication method for printed circuit board

Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate

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Method of manufacturing a semiconductor package with a lead...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Molding apparatus with a molding flowability sensor for...

Plastic article or earthenware shaping or treating: apparatus – With indicator – signal – recorder – illuminator – or inspection... – For molding temperature or pressure
Reexamination Certificate

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Packaging mold with electrostatic discharge protection

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Reexamination Certificate

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Packaging substrate with electrostatic discharge protection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-212215

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