4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Yoon Hwa Choi

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active

Chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Chip stack package utilizing a connecting hole to improve...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Method for fabricating stacked chip package device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Optical coupler package

Radiant energy – Photocells; circuits and apparatus – Signal isolator
Reexamination Certificate

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Stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Profile ID: LFUS-PAI-P-1828637

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