4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Nam Soo Lee

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active

Chip stack package utilizing a connecting hole to improve...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Foil journal bearing utilizing semi-active dampers

Bearings – Rotary bearing – Hydraulic or pneumatic bearing support
Reexamination Certificate

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Method for fabricating stacked chip package device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Smart foil journal bearing with piezoelectric actuators

Bearings – Rotary bearing – Fluid bearing
Reexamination Certificate

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Stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Profile ID: LFUS-PAI-P-1828638

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