Stack etch method for flash memory devices

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438264, H01L 21336

Patent

active

060872209

ABSTRACT:
A method of forming a floating gate memory array is provided that uses a two step etch process to prevent the formation of unwanted trenches 66 into the semiconductor substrate 26. The process may be accomplished by a first etch which is substantially not selective between silicon and dielectric materials. A second etch process is then used which is highly selective to dielectric materials.

REFERENCES:
patent: 5915177 (1999-05-01), Tseng

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