Sputtering chamber coil

Machines not elsewhere specified – Heat treatment – welding or brazing – Solid material melting – e.g. – solder – etc.

Design Patent

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Design Patent

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D0440582

CLAIM:
The ornamental design for sputtering chamber coil, as shown and described.

REFERENCES:
patent: 118252 (1871-08-01), Lewis
patent: 565698 (1896-08-01), Sparks
patent: 4154011 (1979-05-01), Rakestraw et al.
patent: 4361472 (1982-11-01), Morrison, Jr.
patent: 4478437 (1984-10-01), Skinner
patent: 4948458 (1990-08-01), Ogle
patent: 4990229 (1991-02-01), Campbell et al.
patent: 4999096 (1991-03-01), Nihei et al.
patent: 5001816 (1991-03-01), Oetiker
patent: 5122251 (1992-06-01), Campbell et al.
patent: 5146137 (1992-09-01), Gesche et al.
patent: 5150503 (1992-09-01), Müller
patent: 5178739 (1993-01-01), Barnes et al.
patent: 5231334 (1993-07-01), Paranjpe
patent: 5234560 (1993-08-01), Kadlec et al.
patent: 5241245 (1993-08-01), Barnes et al.
patent: 5280154 (1994-01-01), Cuomo et al.
patent: 5304279 (1994-04-01), Coultas et al.
patent: 5346578 (1994-09-01), Benzing et al.
patent: 5397962 (1995-03-01), Moslehi
patent: 5401350 (1995-03-01), Patrick et al.
patent: 5404079 (1995-04-01), Ohkuni et al.
patent: 5418431 (1995-05-01), Williamson et al.
patent: 5429070 (1995-07-01), Campbell et al.
patent: 5429995 (1995-07-01), Nishiyama et al.
patent: 5430355 (1995-07-01), Paranjpe
patent: 5556501 (1996-09-01), Collins et al.
patent: 5637961 (1997-06-01), Ishii et al.
patent: 5669975 (1997-09-01), Ashtiani
patent: 5681393 (1997-10-01), Takagi
patent: 5683537 (1997-11-01), Ishii
patent: 5707498 (1998-01-01), Ngan
patent: 5721021 (1998-02-01), Tobe et al.
patent: 5770098 (1998-06-01), Araki et al.
patent: 5783492 (1998-07-01), Higuchi et al.
patent: 0520519 (1992-12-01), None
patent: 0653776 (1994-10-01), None
patent: 0727923 (1996-02-01), None
patent: 0758148 (1996-08-01), None
patent: 0807954 (1997-11-01), None
patent: 0813227 (1997-12-01), None
patent: 0836219 (1998-04-01), None
patent: 0836218 (1998-04-01), None
patent: 0840351 (1998-05-01), None
patent: 0727807 (1999-09-01), None
patent: 2231197 (1990-11-01), None
patent: 59-190363 (1984-10-01), None
patent: 61-190070 (1986-08-01), None
patent: 6-232055 (1994-08-01), None
patent: 6-283470 (1994-10-01), None
patent: 7-176398 (1995-07-01), None
patent: 7-176399 (1995-07-01), None
patent: 8-153712 (1996-06-01), None
patent: 8-288259 (1996-11-01), None
patent: 8606923 (1986-11-01), None
U.S. application No. 08/559,345 filed Nov. 15, 1995.
U.S. application No. 08/730,722 filed Oct. 8, 1996.
U.S. application No. 09/049,276 filed Mar. 27, 1998.
Search report in PCT/US98/10058 issued Nov. 4, 1998.
Applied Materials, Inc., Exhibit A, Dated prior to Jul. 13, 1998, the filing date of the present application.(Exhibit A is a drawing of a prior art coil design which is prior to the design of the present application).
S.M. Rossnagel et al., “Magnetron Sputter Deposition with High Levels of Metal Ionization,”Appl. Phys. Lett., vol. 63, pp. 3285-3287, 1993.
J. Hopwood et al., “Mechanisms for Highly Ionized Magnetron Sputtering,”J. Appl. Phys.,vol. 78, pp. 758-765, 1995.
S.M. Rossnagel, “Directional and Ionized Sputter Deposition for Microelectronics Applications,”Proc. of 3rd ISSP(Tokyo), pp. 253-260, 1995.
N. Jiwari et al., “Helicon wave plasma reactor employing single-loop antenna,”J. of Vac. Sci. Technol., A 12(4), pp. 1322-1327, Jul./Aug. 1994.
U.S. application No. 08/856,335, filed May 14, 1997.
U.S. application No. 08/857,719, filed May 16, 1997.
U.S. application No. 08/857,944, filed May 16, 1997.
U.S. application No. 09/039,695, filed Mar. 16, 1998.
U.S. application No. 09/064,355, filed Apr. 22, 1998.
U.S. application No. 09/113,577, filed Jul. 10, 1998.
U.S. application No. 29/090,618, filed Jul. 13, 1998.
U.S. application No. 29/109,892.
U.S. application No. 29/109,870.
U.S. application No. 29/109,893.

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