Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2005-05-17
2005-05-17
Patel, Paresh (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S754090, C257S048000
Reexamination Certificate
active
06894522
ABSTRACT:
A method for implementing backside probing of a semiconductor device includes isolating an identified defect area on a backside of the semiconductor device, and milling the identified defect area to an initial depth. Edges of the identified defect area are masked, wherein unmasked semiconductor material, beginning at the initial depth, is etched for a plurality of timed intervals until one or more active devices are reached. The one or more active devices are electrically probed.
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M. Mahanpour et al.; “Die and Solder Ball Defect Inspection in Flip Chipped Packaged Devices;” found at http://www.fabtech.org/features/tap/articles/06.433.html, Total 9 Pages, Sep. 18, 2003.
Averill Barbara A.
Kane Terence
Miles Darrell L.
Oldrey Richard W.
Sylvestri John D.
Cantor & Colburn LLP
International Business Machines - Corporation
Jaklitsch Lisa U.
Patel Paresh
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