4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified configuration

Terence Kane

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Backside integrated circuit die surface finishing technique...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Backside integrated circuit die surface finishing technique...

Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate

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Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Channel stop layer
Reexamination Certificate

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Method for electrically characterizing charge sensitive...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2675940

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