Solder bump structure and method for forming a solder bump

Details Solder bump structure and method for forming a solder bump Solder bump structure and method for forming a solder bump

2005-11-01

2005-11-01

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Preplacing solid filler

C228S180220

Reexamination Certificate

active

06959856

ABSTRACT:
A solder bump structure includes a contact pad, an intermediate layer located over the contact pad, a solder bump located over the intermediate layer, and at least one metal projection extending upwardly from a surface of the intermediate layer and embedded within the solder bump. Any crack in the solder bump will tend to propagate horizontally through the bump material, and in this case, the metal projections act as obstacles to crack propagation. These obstacles have the effect of increasing the crack resistance, and further lengthen the propagation path of any crack as it travels through the solder bump material, thus decreasing the likelihood device failure.

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