4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Se-yong Oh

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Method of forming metal lines and bumps for semiconductor...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Solder bump structure and method for forming a solder bump

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2891192

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