4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

Nam-seog Kim

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Ag-pre-plated lead frame for semiconductor package

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Reinforced solder bump structure and method for forming a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Reinforced solder bump structure and method for forming a...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Solder bump structure and method for forming a solder bump

Metal fusion bonding – Process – Preplacing solid filler
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Profile ID: LFUS-PAI-P-2677369

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