4. Metal fusion bonding
  5. Process
  6. With protecting of work or filler or applying flux

Clément J. Fortin

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SMT passive device noflow underfill methodology and structure

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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SMT passive device noflow underfill methodology and structure

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

SMT passive device noflow underfill methodology and structure

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-2714483

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