Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2007-02-27
2007-02-27
Sarkar, Asok Kumar (Department: 2891)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S455000, C257SE21320
Reexamination Certificate
active
10989993
ABSTRACT:
A method of fabricating a semiconductor-on-insulator structure from a pair of semiconductor wafers, includes forming an oxide layer on at least a first surface of a first one of the wafers and performing a bonding enhancement implantation step by ion implantation of a first species in the first surface of at least either of the pair of wafers. The method further includes performing a cleavage ion implantation step on one of the pair of wafers by ion implanting a second species to define a cleavage plane across a diameter of the wafer at the predetermined depth below the top surface of the one wafer. The wafers are then bonded together by placing the first surfaces of the pair of wafers onto one another so as to form an semiconductor-on-insulator structure. The method also includes separating the one wafer along the cleavage plane so as to remove a portion of the one wafer between the second surface and the cleavage plane, whereby to form an exposed cleaved surface of a remaining portion of the one wafer on the semiconductor-on-insulator structure. Finally, the cleaved surface is smoothed, preferably by carrying out a low energy high momentum ion implantation step.
REFERENCES:
patent: 2344138 (1944-03-01), Drummond
patent: 3109100 (1963-10-01), Gecewicz
patent: 3576685 (1971-04-01), Swann et al.
patent: 3907616 (1975-09-01), Wiemer
patent: 4116791 (1978-09-01), Zega
patent: 4176003 (1979-11-01), Brower et al.
patent: 4382099 (1983-05-01), Legge et al.
patent: 4385946 (1983-05-01), Finegan et al.
patent: 4434036 (1984-02-01), Hoerschelmann et al.
patent: 4465529 (1984-08-01), Arima et al.
patent: 4481229 (1984-11-01), Suzuki et al.
patent: 4500563 (1985-02-01), Ellenberger et al.
patent: 4521441 (1985-06-01), Flowers
patent: 4539217 (1985-09-01), Farley
patent: 4565588 (1986-01-01), Seki et al.
patent: 4579618 (1986-04-01), Celestino et al.
patent: 4584026 (1986-04-01), Wu et al.
patent: 4698104 (1987-10-01), Barker et al.
patent: 4764394 (1988-08-01), Conrad
patent: 4778561 (1988-10-01), Ghanbari
patent: 4837172 (1989-06-01), Mizuno et al.
patent: 4867859 (1989-09-01), Harada et al.
patent: 4871421 (1989-10-01), Ogle et al.
patent: 4892753 (1990-01-01), Wong et al.
patent: 4912065 (1990-03-01), Mizuno et al.
patent: 4937205 (1990-06-01), Nakayama et al.
patent: 4948458 (1990-08-01), Ogle
patent: 5040046 (1991-08-01), Chhabra et al.
patent: 5061838 (1991-10-01), Lane et al.
patent: 5074456 (1991-12-01), Degner et al.
patent: 5106827 (1992-04-01), Borden et al.
patent: 5107201 (1992-04-01), Ogle
patent: 5229305 (1993-07-01), Baker
patent: 5270250 (1993-12-01), Murai et al.
patent: 5277751 (1994-01-01), Ogle
patent: 5288650 (1994-02-01), Sandow
patent: 5290382 (1994-03-01), Zarowin et al.
patent: 5312778 (1994-05-01), Collins et al.
patent: 5354381 (1994-10-01), Sheng
patent: 5435881 (1995-07-01), Ogle
patent: 5505780 (1996-04-01), Dalvie et al.
patent: 5510011 (1996-04-01), Okamura et al.
patent: 5514603 (1996-05-01), Sato
patent: 5520209 (1996-05-01), Goins et al.
patent: 5542559 (1996-08-01), Kawakami et al.
patent: 5561072 (1996-10-01), Saito
patent: 5569363 (1996-10-01), Bayer et al.
patent: 5572038 (1996-11-01), Sheng et al.
patent: 5587038 (1996-12-01), Cecchi et al.
patent: 5627435 (1997-05-01), Jansen et al.
patent: 5643838 (1997-07-01), Dean et al.
patent: 5648701 (1997-07-01), Hooke et al.
patent: 5653811 (1997-08-01), Chan
patent: 5654043 (1997-08-01), Shao et al.
patent: 5660895 (1997-08-01), Lee et al.
patent: 5674321 (1997-10-01), Pu et al.
patent: 5683517 (1997-11-01), Shan
patent: 5711812 (1998-01-01), Chapek et al.
patent: 5718798 (1998-02-01), Deregibus
patent: 5770982 (1998-06-01), Moore
patent: 5885358 (1999-03-01), Maydan et al.
patent: 5888413 (1999-03-01), Okumura et al.
patent: 5897713 (1999-04-01), Tomioka et al.
patent: 5897752 (1999-04-01), Hong et al.
patent: 5911832 (1999-06-01), Denholm et al.
patent: 5935077 (1999-08-01), Ogle
patent: 5944942 (1999-08-01), Ogle
patent: 5948168 (1999-09-01), Shan et al.
patent: 5958140 (1999-09-01), Arami et al.
patent: 5985742 (1999-11-01), Henley et al.
patent: 5994207 (1999-11-01), Henley et al.
patent: 5994236 (1999-11-01), Ogle
patent: 5998933 (1999-12-01), Shun'Ko
patent: 6000360 (1999-12-01), Koshimizu
patent: 6013567 (2000-01-01), Henley et al.
patent: 6020592 (2000-02-01), Liebert et al.
patent: 6041735 (2000-03-01), Murzin et al.
patent: 6050218 (2000-04-01), Chen et al.
patent: 6076483 (2000-06-01), Shintani et al.
patent: 6083324 (2000-07-01), Henley et al.
patent: 6096661 (2000-08-01), Ngo et al.
patent: 6101971 (2000-08-01), Denholm et al.
patent: 6103599 (2000-08-01), Henley et al.
patent: 6121161 (2000-09-01), Rossman et al.
patent: 6132552 (2000-10-01), Donohoe et al.
patent: 6139697 (2000-10-01), Chen et al.
patent: 6150628 (2000-11-01), Smith et al.
patent: 6153524 (2000-11-01), Henley et al.
patent: 6155090 (2000-12-01), Rubensson
patent: 6164241 (2000-12-01), Chen et al.
patent: 6165376 (2000-12-01), Miyake et al.
patent: 6174450 (2001-01-01), Patrick et al.
patent: 6174743 (2001-01-01), Pangrle et al.
patent: 6180496 (2001-01-01), Farrens et al.
patent: 6182604 (2001-02-01), Goeckner et al.
patent: 6187110 (2001-02-01), Henley et al.
patent: 6207005 (2001-03-01), Henley et al.
patent: 6237527 (2001-05-01), Kellerman et al.
patent: 6239553 (2001-05-01), Barnes et al.
patent: 6248642 (2001-06-01), Dolan et al.
patent: 6265328 (2001-07-01), Henley et al.
patent: 6291313 (2001-09-01), Henley et al.
patent: 6291939 (2001-09-01), Nishida
patent: 6300643 (2001-10-01), Fang et al.
patent: 6303519 (2001-10-01), Hsiao
patent: 6305316 (2001-10-01), DiVergilio et al.
patent: 6335536 (2002-01-01), Goeckner et al.
patent: 6339297 (2002-01-01), Sugai et al.
patent: 6341574 (2002-01-01), Bailey, III et al.
patent: 6344404 (2002-02-01), Cheung et al.
patent: 6348126 (2002-02-01), Hanawa et al.
patent: 6375790 (2002-04-01), Fenner
patent: 6387719 (2002-05-01), Mrvos et al.
patent: 6392351 (2002-05-01), Shun'Ko
patent: 6395150 (2002-05-01), Can Cleemput et al.
patent: 6403453 (2002-06-01), Ono et al.
patent: 6410449 (2002-06-01), Hanawa et al.
patent: 6413321 (2002-07-01), Kim et al.
patent: 6417078 (2002-07-01), Dolan et al.
patent: 6418874 (2002-07-01), Cox et al.
patent: 6426015 (2002-07-01), Xia et al.
patent: 6432260 (2002-08-01), Mahoney et al.
patent: 6433553 (2002-08-01), Goeckner et al.
patent: 6453842 (2002-09-01), Hanawa et al.
patent: 6461933 (2002-10-01), Houston
patent: 6468388 (2002-10-01), Hanawa et al.
patent: 6492612 (2002-12-01), Taguchi et al.
patent: 6494986 (2002-12-01), Hanawa et al.
patent: 6511899 (2003-01-01), Henley et al.
patent: 6513538 (2003-02-01), Chung et al.
patent: 6514838 (2003-02-01), Chan
patent: 6528391 (2003-03-01), Henley et al.
patent: 6551446 (2003-04-01), Hanawa et al.
patent: 6559408 (2003-05-01), Smith et al.
patent: 6582999 (2003-06-01), Henley et al.
patent: 6593173 (2003-07-01), Anc et al.
patent: 6632324 (2003-10-01), Chan
patent: 6643557 (2003-11-01), Miller et al.
patent: 6645828 (2003-11-01), Farrens et al.
patent: 6679981 (2004-01-01), Pan et al.
patent: 6747243 (2004-06-01), Reinhardt
patent: 6780759 (2004-08-01), Farrens et al.
patent: 6811448 (2004-11-01), Paton et al.
patent: 6838695 (2005-01-01), Doris et al.
patent: 6887341 (2005-05-01), Strang et al.
patent: 2001/0017109 (2001-08-01), Liu et al.
patent: 2001/0042827 (2001-11-01), Fang et al.
patent: 2002/0047543 (2002-04-01), Sugai et al.
patent: 2003/0013260 (2003-01-01), Gossman et al.
patent: 2003/0029567 (2003-02-01), Dhindsa et al.
patent: 2003/0085205 (2003-05-01), Lai et al.
patent: 2003/0211705 (2003-11-01), Tong et al.
patent: 2004/0036038 (2004-02-01), Okumura et al.
patent: 2004/0092084 (2004-05-01), Rayssac
patent: 2004/0126993 (2004-07-01), Chan et al.
patent: 0 546 852 (1993-06-01), None
patent: 0 836 218 (1998-04-01), None
patent: 0 964 074 (1999-12-01), None
patent: 1 054 433 (2000-11-01), None
patent: 1 111 084 (2001-06-01), None
patent: 1 158 071 (2001-11-01), None
patent: 1 191 121 (2002-03-01), None
patent: 59-86214 (1984-05-01), None
patent: 59-218728 (1984-12-01), None
patent: 62-1
Al-Bayati Amir
Collins Kenneth S.
Gallo Biagio
Hanawa Hiroji
Nguyen Andrew
Applied Materials Inc.
Law Office of Robert M. Wallace
Sarkar Asok Kumar
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