Silicon carbide semiconductor device and process for...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S570000, C438S758000

Reexamination Certificate

active

07462540

ABSTRACT:
A method for fabricating a semiconductor device includes the steps of implanting ions into a silicon carbide thin film (2) formed on a silicon carbide substrate (1), heating the silicon carbide substrate in a reduced pressure atmosphere to form a carbon layer (5) on the surface of the silicon carbide substrate, and performing activation annealing with respect to the silicon carbide substrate in an atmosphere under a pressure higher than in the step of forming the carbon layer (5) and at a temperature higher than in the step of forming the carbon layer (5).

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Chinese Office Action, with English translation, issued in Chinese Patent Application No. CN 200580003598, mailed Jan. 4, 2008.

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