Silicon carbide semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438275, 438981, H01L 21336, H01L 218234

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active

059769360

ABSTRACT:
A silicon carbide semiconductor device having a high blocking voltage, low loss, and a low threshold voltage is provided. An n.sup.+ type silicon carbide semiconductor substrate 1, an n.sup.- type silicon carbide semiconductor substrate 2, and a p type silicon carbide semiconductor layer 3 are successively laminated on top of one another. An n.sup.+ type source region 6 is formed in a predetermined region of the surface in the p type silicon carbide semiconductor layer 3, and a trench 9 is formed so as to extend through the n.sup.+ type source region 6 and the p type silicon carbide semiconductor layer 3 into the n.sup.- type silicon carbide semiconductor layer 2. A thin-film semiconductor layer (n type or p type) 11a is extendedly provided on the surface of the n.sup.+ type source region 6, the p type silicon carbide semiconductor layer 3, and the n.sup.- type silicon carbide semiconductor layer 2 in the side face of the trench 9.

REFERENCES:
patent: 4859621 (1989-08-01), Einthoven
patent: 5170231 (1992-12-01), Fuji
patent: 5233215 (1993-08-01), Baliga
patent: 5323040 (1994-06-01), Baliga
patent: 5389799 (1995-02-01), Uemoto
patent: 5396085 (1995-03-01), Baliga
patent: 5399515 (1995-03-01), Davis
patent: 5451797 (1995-09-01), Davis
patent: 5506421 (1996-04-01), Palmour
patent: 5514604 (1996-05-01), Brown
patent: 5574295 (1996-11-01), Kurtz
patent: 5614749 (1997-03-01), Vend
patent: 5723376 (1998-03-01), Takeuchi
patent: 5744826 (1998-04-01), Takeuchi et al.
Spencer et al., "Silicon Carbide and Related Materials", Inst. Phys. Conf. Ser. No. 137, Nov. 1-3, 1993, pp. 55-58.
"Electronic Components and Circuits", NASA Tech Briefs, Feb. 1995, various pages Month Unknown.
Palmour et al., "Proceedings of the 28th Intersociety Energy Conversion Engineering Conference", American Chemical Society, 1993, pp. 1249-1254 Month Unknown.
Suzuki et al., "Thermal Oxidation of SiC and Electrical Properties of Al-SiO.sub.2 -SiC MOS Structure", Japanese Journal of Applied Physics, vol. 21, No. 4, Apr. 1982, pp. 579-585.
"Thermal Oxidation Characteristics of 6H-SiC and Field Effect Characteristics of Vertical SiO.sub.2 /6H-SiC Interface" (Seminar an SiC and Related Wide Gap Semiconductors, Proceedings of 3rd Meeting) & "Relevancy with Present Invention" (Applicant's Comments) Date Unknown.
Patent Abstract of Japan, vol. 017 No. 006 (E-1302) re JP-A 04-239778 Jan. 1993.
Patent Abstract of Japan, vol. 014, No. 288 (E-0943) re JP-A 02-091976, Jun. 1990.
Jayant Baliga B, "Critical Nature of Oxide/Interface Quality for SIC Power Devices", Microelectronic Engineering, vol. 28 No. 1/Jun. 4, 1995 p. 182.

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