Sensor device and fabrication method for the same

Details Sensor device and fabrication method for the same Sensor device and fabrication method for the same

2011-03-29

2011-03-29

Landau, Matthew C (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257SE29324, C438S053000

Reexamination Certificate

active

07915697

ABSTRACT:
The sensor device includes: a converter body made of silicon in the shape of a rhombus in plan, the converter body having an opening in the shape of a hexagon in plan; a substrate for holding the converter body; a movable film formed on the opening; a converter electrode formed on the converter body; and a substrate electrode formed on the substrate, the substrate electrode being electrically connected with the converter electrode. The opening is placed so that four of the six sides of the hexagon extend along the four sides of the rhombus of the converter body.

REFERENCES:
patent: 5793073 (1998-08-01), Kaminishi et al.
patent: 6601452 (2003-08-01), Murata et al.
patent: 6789431 (2004-09-01), Ishio
patent: 2007/0058826 (2007-03-01), Sawamoto et al.
patent: 2010/0124344 (2010-05-01), Mizutani et al.
patent: 2010/0176467 (2010-07-01), Fukasawa et al.
patent: 2010/0189289 (2010-07-01), Takeuchi
patent: 05-275530 (1993-10-01), None
patent: 09-092670 (1997-04-01), None
patent: 3295957 (2002-04-01), None

Affiliated with

Also associated with

Rating

Sensor device and fabrication method for the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sensor device and fabrication method for the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sensor device and fabrication method for the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2726773