4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Masanori Minamio

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active

Bonded structure and bonding method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Connection structure and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Image sensor

Photography and optical equipment – Optical article not elsewhere specified
Design Patent

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Image sensor

Photography and optical equipment – Optical article not elsewhere specified
Design Patent

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Lead frame and method of manufacturing the same, and resin seale

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Profile ID: LFUS-PAI-P-540813

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