Semiconductor wafer transfer in processing systems

Details Semiconductor wafer transfer in processing systems Semiconductor wafer transfer in processing systems

1990-03-19

1992-03-31

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

118728, 118 501, 118620, 156345, 20429835, 4147441, B44C 122, H01L 21306

Patent

active

051005026

ABSTRACT:
An improved semiconductor wafer transfer method and system incorporates a combination of wafer retractor (14) and wafer lifters (16) built into each processing chamber with a modified transport arm (12) to achieve large enhancements in wafer exchange speeds. The transport arm (12) brings a new wafer into a processing chamber (18) where an already processed wafer waits for retrieval, having been lifted into the central portion of the chamber by lifters (16). In a simultaneous action, lifters (16) lower the processed wafer onto a lower platform of the transport arm (12) while the wafer retractor (14) removes the new wafer from an upper platform of the transport arm (12). Once the transport arm (12) removes the processed wafer from the chamber (18), the retractor (14) lowers the new wafer onto the wafer lifters (16) and processing begins. The transport arm (12) delivers the processed wafer to a wafer buffer (58), which accompanies the transport arm (12), and retrieves a new wafer to start the wafer loading process again with the next processing chamber (18). The method and system of the present invention provides a flexible and rapid solution for loading and unloading wafer processing chambers.

REFERENCES:
patent: 4151034 (1979-04-01), Yamamoto et al.
patent: 4487678 (1984-12-01), Noguchi et al.
patent: 4526670 (1985-07-01), Hajj
patent: 4715921 (1987-12-01), Maher et al.

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