Semiconductor wafer processing apparatus including localized hum

Coating apparatus – With means to centrifuge work

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Details

118 56, 118 66, 118319, 118320, 118641, B05C 500

Patent

active

057256640

ABSTRACT:
An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an interface section arranged between the coating section and the heating section. The wafers are heat-treated in the heat treatment section while the wafers are stacked at intervals in a vertical direction in a boat. The wafers which have undergone the coating treatment are loaded into the boat by a conveying member in the interface section. The conveying member and the boat are surrounded by a surrounding space formed by a casing at the interface section. A circulation line is combined with an air supply and exhaust system, for circulating air in the surrounding space. A dehumidifier is arranged on the circulation line for dehumidifying air in the circulation line to provide localized dehumidification of the surrounding space formed by the casing.

REFERENCES:
patent: 5143552 (1992-09-01), Moriyama
patent: 5454871 (1995-10-01), Liaw et al.

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