Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Patent
1998-01-14
2000-02-08
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
With means to control surface effects
Insulating coating
257783, 257797, H01L 2358
Patent
active
060230940
ABSTRACT:
Disclosed is a packaged integrated circuit device. The device includes a die having a plurality of electrical contacts on a first surface of the die and a protective film adhered directly to a back surface of the die, the protective film being thick enough to allow laser marking of the protective film without the laser penetrating to the die. In one preferred embodiment, the protective film of the device is a thick film formed by screen printing. In a preferred embodiment, the protective film has a thickness of between about 1.5 and 5 mils. Also, disclosed is a method of fabricating a semiconductor wafer having a wafer substrate with a top surface and a bottom surface and a plurality of dies. In this embodiment, the method includes providing a plurality of dies on the top surface of the wafer substrate, applying a thick film over the bottom surface of the wafer substrate, adhering the thick film to a mounting tape that is not ultraviolet curable, and dicing the wafer to separate the dies. The thick film reduces chipping along edges of the separated dies.
REFERENCES:
patent: 4560580 (1985-12-01), Needham et al.
patent: 5083191 (1992-01-01), Ueda
patent: 5294812 (1994-03-01), Hashimoto et al.
Kao Pai-Hsiang
Kelkar Nikhil Vishwanath
Schaefer William Jeffrey
Clark Sheila V.
National Semiconductor Corporation
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