4. Active solid-state devices (e.g., transistors, solid-state diode
  5. With means to control surface effects
  6. Insulating coating

Pai-Hsiang Kao

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Metal pads for electrical probe testing on wafer with bump...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Methods and apparatuses for singulation of microelectromechanica

Semiconductor device manufacturing: process – Semiconductor substrate dicing
Patent

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Opaque metallization to cover flip chip die surface for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Semiconductor wafer having a bottom surface protective coating

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Patent

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Semiconductor wafer having a bottom surface protective coating

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reissue Patent

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Profile ID: LFUS-PAI-P-1613327

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