Semiconductor stacked multi-package module having inverted...

Details Semiconductor stacked multi-package module having inverted... Semiconductor stacked multi-package module having inverted...

2006-06-13

2006-06-13

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S784000, C257S787000, C361S736000, C361S760000, C361S776000

Reexamination Certificate

active

07061088

ABSTRACT:
A semiconductor multi-package module has stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding, and in which the upper package is inverted. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.

REFERENCES:
patent: 5222014 (1993-06-01), Lin
patent: 5444296 (1995-08-01), Kaul et al.
patent: 5744863 (1998-04-01), Culnane et al.
patent: 5994166 (1999-11-01), Akram et al.
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6265766 (2001-07-01), Moden
patent: 6407456 (2002-06-01), Ball
patent: 6413798 (2002-07-01), Asada
patent: 6414381 (2002-07-01), Takeda
patent: 6462421 (2002-10-01), Hsu et al.
patent: 6472741 (2002-10-01), Chen et al.
patent: 6512303 (2003-01-01), Moden
patent: 6545366 (2003-04-01), Michii et al.
patent: 6552423 (2003-04-01), Song et al.
patent: 6590281 (2003-07-01), Wu et al.
patent: 6593648 (2003-07-01), Emoto
patent: 6607937 (2003-08-01), Corisis
patent: 6649448 (2003-11-01), Tomihara
patent: 6667556 (2003-12-01), Moden
patent: 6716676 (2004-04-01), Chen et al.
patent: 6734539 (2004-05-01), Degani et al.
patent: 6734552 (2004-05-01), Combs et al.
patent: 6737750 (2004-05-01), Hoffman et al.
patent: 6746894 (2004-06-01), Fee et al.
patent: 6762488 (2004-07-01), Maeda et al.
patent: 6777819 (2004-08-01), Huang
patent: 6787916 (2004-09-01), Halahan
patent: 6835598 (2004-12-01), Baek et al.
patent: 6838761 (2005-01-01), Karnezos
patent: 6864566 (2005-03-01), Choi, III
patent: 6906416 (2005-06-01), Karnezos
patent: 2003/0230801 (2003-12-01), Jiang et al.
patent: 2004/0100772 (2004-05-01), Chye et al.
patent: 2001223326 (2001-08-01), None
patent: 2001068614 (2001-07-01), None
patent: 2004085348 (2004-10-01), None

Affiliated with

Also associated with

Rating

Semiconductor stacked multi-package module having inverted... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor stacked multi-package module having inverted..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor stacked multi-package module having inverted... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3647202