Semiconductor package with improved chip attachment and...

Details Semiconductor package with improved chip attachment and... Semiconductor package with improved chip attachment and...

2007-06-26

2007-06-26

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S777000, C257S778000, C257S779000, C257S780000, C257S781000, C257S782000, C257S784000, C257SE21514

Reexamination Certificate

active

10912861

ABSTRACT:
A semiconductor package comprises a chip having a top surface for chip pads and a bottom surface opposite the top surface. The top and bottom surfaces define side surfaces. The package further includes an adhesive layer provided within a chip-attaching area substantially defined by side surfaces of the chip and attaches a chip to, for example, a substrate having substrate pads. This prevents the contamination of the substrate pads by the adhesive layer. In one embodiment, the adhesive layer has at least one hole formed therethrough to expose a portion of the bottom surface of the chip. The adhesive layer may include at least one passage laterally connecting the hole to the outside. Alternatively, the adhesive layer has a plurality of adhesive parts separately disposed on the semiconductor chip.

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