Semiconductor package with a support structure and...

Details Semiconductor package with a support structure and... Semiconductor package with a support structure and...

2011-02-22

2011-02-22

Roman, Angel (Department: 2812)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S678000, C257S730000, C257SE23116, C257SE23123, C257SE23124

Reexamination Certificate

active

07893547

ABSTRACT:
A semiconductor package with a support structure and a fabrication method thereof are provided. With a chip being electrically connected to electrical contacts formed on a carrier, a molding process is performed. A plurality of recessed portions formed on the carrier are filled with an encapsulant for encapsulating the chip during the molding process. After the carrier is removed, the part of the encapsulant filling the recessed portions forms outwardly protruded portions on a surface of the encapsulant, such that the semiconductor package can be attached to an external device via the protruded portions.

REFERENCES:
patent: 5830800 (1998-11-01), Lin
patent: 6541848 (2003-04-01), Kawahara et al.
patent: 6933594 (2005-08-01), McLellan et al.
patent: 6964918 (2005-11-01), Fan et al.
patent: 2003/0209785 (2003-11-01), Choi et al.

Affiliated with

Also associated with

Rating

Semiconductor package with a support structure and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package with a support structure and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package with a support structure and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2639753