Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2008-01-08
2008-01-08
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S707000, C257S713000, C257S719000, C257S686000, C257SE33075, C257SE23051, C257SE23085
Reexamination Certificate
active
07317247
ABSTRACT:
A semiconductor package which can be stacked to form a package stack that includes a semiconductor chip with bonding pads, a board having contact pads on its upper surface and bump pads on its lower surface, a heat spreader attached to the rear side of the semiconductor chip and covering the upper surface of the board, and external contact terminals including ground terminals and signal terminals formed on the bump pads. The contact pads of the board include ground contact pads connected with the ground terminals and signal contact pads connected with the signal terminals. The heat spreader includes indented parts to expose the signal contact pads and protruded parts to cover the ground contact pads which are exposed through holes formed on the protruded parts on the peripheral part of the heat spreader. The semiconductor package can alternatively have the heat spreader attached to the lower surface of the board.
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English language abstract of Korean Publication No. 2002-0055687.
English language abstract of Korean Publication No. 2003-0041653.
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English language abstract of Japanese Publication No. 2000-114413.
English language abstract of Korean Publication No. 2003-0060436.
English language abstract of Japanese Publication No. 2004-031650.
Lee Jong-joo
Song Young-hee
Clark Jasmine
Marger & Johnson & McCollom, P.C.
Samsung Electronics Co,. Ltd.
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