4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Young-hee Song

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active

BGA semiconductor chip package and mounting structure thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Down-bonded lead-on-chip type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Semiconductor device having fuse circuit on cell region and...

Semiconductor device manufacturing: process – Making device array and selectively interconnecting
Reexamination Certificate

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Semiconductor module

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit
Patent

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Semiconductor package

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit
Patent

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Profile ID: LFUS-PAI-P-491061

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